Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP

Lorentz Solution, Inc. announced it will jointly present a technical paper with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum on September 23, 2026, in Santa Clara, California. This collaboration marks the third consecutive year the two companies have presented advanced electromagnetic (EM) technologies for silicon designs at TSMC OIP. The presentation, titled 'Large-scale Chip-level 3D EM Extraction and Sign-off of Ultra-high-speed Silicon Photonics and Custom Silicon IC/3DIC Designs with PeakView,' highlights Lorentz's PeakView automated xLEM flow. As AI data centers transition into large-scale distributed compute fabrics requiring multi-terabit interconnects, traditional RC-based parasitic extraction struggles with inductive effects and signal loss. PeakView's xLEM technology solves this by automating fullwave 3D EM extraction directly from LVS databases up to terahertz frequencies. The ongoing partnership underscores NVIDIA's technological focus on next-generation silicon photonics, co-packaged optics, and advanced IC/3DIC packaging to enhance AI data center compute performance and energy efficiency.