Huawei unveils new smartphone chips this fall as rivalry with Nvidia and Apple heats up

Huawei unveiled a new chip engineering approach called “LogicFolding” that it plans to deploy in Kirin smartphone chips this fall, positioning the company to further challenge Apple in China and tighten the market window for Nvidia’s high-end chips amid U.S. export restrictions. Huawei claims the method could deliver capabilities equivalent to a 1.4‑nanometer process by 2031, while TSMC is already in volume production of 2nm chips. Analysts cautioned the claim may overstate progress, citing unresolved yield, power, thermal and manufacturing-scale issues. Market impact: the announcement raises competitive pressures on AAPL.OQ in China and could further limit NVDA.OQ’s addressable market there, while underscoring Beijing’s push for homegrown semiconductor advances.