Apple Commits $30 Billion to Broadcom for U.S. Chip Production

On July 8, Apple announced a multi-year commitment exceeding $30 billion to Broadcom for custom silicon and wireless components through 2031. The deal expands on the July 6 agreement and will drive production of over 15 billion chips at U.S. facilities, including a $1.5 billion Broadcom plant upgrade in Fort Collins, Colorado. It aligns with Apple’s $600 billion domestic investment plan. Earlier market moves included SK Hynix’s $28 billion U.S. ADR launch and reports of a $14.5 billion Solstice-Element Solutions merger.