Amkor Technology, NVIDIA sign multi-year deal to boost U.S. AI chip packaging

NVIDIA and Amkor Technology announced a multi-year strategic partnership aimed at advancing semiconductor packaging and testing for next-generation AI platforms. NVIDIA will make a prepayment to help expand Amkor’s advanced packaging capacity in Arizona, though financial terms were not disclosed. The deal deepens an existing relationship across data center processors, networking chips, and AI computing platforms, and is intended to strengthen U.S.-based turnkey packaging and testing while improving supply-chain resilience alongside Amkor’s Asian manufacturing footprint. The announcement is positive for the AI hardware ecosystem, as it supports domestic packaging capacity that could ease bottlenecks in advanced chip production and reinforce NVIDIA’s supply chain for future AI infrastructure and accelerated computing systems.